Amkor is currently looking to fill a Product Management position for the Advanced Flip Chip Packaging Assembly Business Unit in Tempe, AZ. This position includes cross functional management and direct customer interactions for new product development, qualification and mass production of advanced flip chip products.
The primary functions of this position are:
• Responsibility for substrate technology path finding and roadmap execution
• Direct interface with suppliers and factory engineers for new substrate development and qualification
• Drive substrate suppliers to meet technology requirements and timelines
• Work across different functional groups and involvement with engineering, product development and associated product lines
Duties include the daily application of detailed knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development / NPI programs. Driving customer requirements and timelines to multiple SEA factories. Deep diving into root cause failure analysis and clearing obstacles with product design, reliability, and manufacturability issues. Performing and analyzing detailed cost modeling for providing product level assembly pricing. Chosen candidate will be responsible for driving cost reductions and increased revenues within assigned customer base.

This role combines deep technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill. The chosen individual will need to help define and concurrently manage ownership of multiple programs, from both the business and technical sides.

• Develop stronger relationship with all substrate suppliers
• Work closely with suppliers to identify capabilities and capacities for all key processes and material sets (ABF, uBall, stacked vias, Coreless, etc.)
• Align on Technology Roadmaps and drive flip chip priorities such as AiP and Automotive
• Qualify and enable new suppliers
• Participate in pricing and capacity negotiations
• Assist/lead to resolve substrate quality issues at suppliers and Amkor factories

QUALIFICATIONS:
• This position requires at least a Bachelor's Degree in related Engineering field (Mechanical, Chemical, Materials, Electrical engineering) and 10+ years of experience in the semiconductor industry; or a Master's Degree in Engineering with a minimum of 8 years of relevant, industry experience
• Exhibit extremely organized technical Project Management experience (preferably, involving off-shore factories) and the ability to multiplex across numerous programs and teams is essential
• Demonstrated ability to work independently in a heavily matrixed organization. Needs to be self-driven and very motivated to adapt and overcome obstacles across a multi-faceted job role, assuming ownership of program success is a must
• Solid knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various flip chip package form factors
• Requires excellent written and verbal communication skills
• Frequent face to face and teleconference technical presentations to customers is required
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required
• This position requires approximately 15% domestic and 15% international travel
• Hands on manufacturing / technical experience is a big plus
• PMP certified project management also a plus
• Experience with cost modeling, pricing, quoting activities and products would be beneficial
• Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures are desired
• Experience / knowledge of flip chip packaging failure analysis methods is desired
• Familiarity with Design of Experiments and Statistical Process Control (JMP) is a plus